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? 2002-2012 microchip technology inc. ds21368c-page 1 tc1223/tc1224 features ? extremely low ground current for longer battery life ? very low dropout voltage ? choice of 50ma and 100ma output (tc1223, tc1224, respectively) ? high output voltage accuracy ? standard or custom output voltages ? power saving shutdown mode ? over current and over temperature protection ? space-saving 5-pin sot-23a package ? pin compatible upgrades for bipolar regulators applications ? battery operated systems ? portable computers ? medical instruments ? instrumentation ? cellular/gsm/phs phones ? linear post-regulators for smps ? pagers device selection table note: xx indicates output voltages available output voltages: 2.5, 2.7, 2.8, 2.85, 3.0, 3.3, 3.6, 4.0, 5.0. other output voltages are avail able. please contact microchip technology inc. for details. package type general description the tc1223 and tc1224 are high accuracy (typically 0.5%) cmos upgrades for older (bipolar) low dropout regulators such as the lp2980. designed specifically for battery-operated systems, the devices? cmos construction eliminates wasted ground current, significantly extending battery life. total supply current is typically 50 ? a at full load (20 to 60 times lower than in bipolar regulators). the devices? key features include ultra low noise operation; very low dropout voltage (typically 85mv, tc1223 and 180mv, tc1224 at full load) and fast response to step changes in load. supply current is reduced to 0.5 ? a (max) and v out falls to zero when the shutdown input is low. the devices incorporate both over temperature and over current protection. the tc1223 and tc1224 are stable with an output capacitor of only 1 ? f and have a maximum output current of 50ma and 100ma respectively. for higher output current versions, please see the tc1107, tc1108 and tc1173 (i out = 300ma) data sheets. typical application part number package junction temp. range tc1223-xxvct 5-pin sot-23a -40c to +125c tc1224-xxvct 5-pin sot-23a -40c to +125c 5-pin sot-23a shdn 5 tc1223 tc1224 13 4 2 v in v out gnd nc note: 5-pin sot-23a is equivalent to the eiaj (sc-74a) tc1223 tc1224 v out shdn gnd nc 1 f + v in v in v out 1 5 2 4 3 shutdown control (from power control logic) 50ma and 100ma cmos ld os with shutdown
tc1223/tc1224 ds21368c-page 2 ? 2002-2012 microchip technology inc. 1.0 electrical specifications absolute maximum ratings* input voltage .........................................................6.5v output voltage........................... (-0.3v) to (v in + 0.3v) power dissipation.............................. internally limited maximum voltage on any pin ........v in +0.3v to -0.3v operating temperature range...... -40c < t j < 125c storage temperature..........................-65c to +150c stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. tc1223/tc1224 electrical specifications electrical characteristics: v in = v out + 1v, i l = 100 ? a, c l = 3.3 ? f, shdn > v ih , t a = 25c, unless otherwise noted. boldface type specifications apply for junction temperatures of -40c to +125c. symbol parameter min typ max units test conditions v in input operating voltage 2.7 ? 6.0 v note 8 i out max maximum output current 50 100 ? ? ? ? ma tc1223 tc1224 v out output voltage v r ? 2.5% v r 0.5% v r + 2.5% v note 1 tcv out v out temperature coefficient ? ? 20 40 ? ? ppm/c note 2 ? v out / ? v in line regulation ? 0.05 0.35 %(v r + 1v) ?? v in ??? 6v ? v out /v out load regulation ? 0.5 2 %i l = 0.1ma to i out max (note 3) v in -v out dropout voltage tc1224 ? ? ? ? 2 65 85 180 ? ? 120 250 mv i l = 100 ? a i l = 20ma i l = 50ma i l = 100ma (note 4) i in supply current ? 50 80 ? a shdn = v ih , i l = 0 (note 7) i insd shutdown supply current ? 0.05 0.5 ? a shdn = 0v psrr power supply rejection ratio ? 64 ? db f re ?? 1khz i out sc output short circuit current ? 300 450 ma v out = 0v ? v out / ? p d thermal regulation ? 0.04 ? v/w notes 5, 6 t sd thermal shutdown die temperature ? 160 ? c ? t sd thermal shutdown hysteresis ? 10 ? c en output noise ? 260 ? nv/ ? hz i l = i out max shdn input v ih shdn input high threshold 45 ??%v in v in = 2.5v to 6.5v v il shdn input low threshold ? ? 15 %v in v in = 2.5v to 6.5v note 1: v r is the regulator output voltage setting. for example: v r = 2.5v, 2.7v, 2.85v, 3.0v, 3.3v, 3.6v, 4.0v, 5.0v. 2: 3: regulation is measured at a constant juncti on temperature using low duty cycle pulse testing. load regulation is tested over a load range from 0.1ma to the maximum specified output current. changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1v differential. 5: thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, exclu ding load or line regulation effects. specifications are for a current pulse equal to i l max at v in = 6v for t = 10 msec. 6: the maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and th e thermal resistance from junction-to-air (i.e., t a , t j , ? ja ). exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. please see section 4.0 thermal considerations for more details. 7: apply for junction temperatures of -40c to +85c. 8: the minimum v in has to justify the conditions: v in ? v r + v dropout and v in ? 2.7v for i l = 0.1ma to i out max . tc v out = (v out max ? v out min ) x 10 6 v out x ? t
? 2002-2012 microchip technology inc. ds21368c-page 3 tc1223/tc1224 2.0 pin descriptions the descriptions of the pins are listed in table 2-1. table 2-1: pin function table pin no. (5-pin sot-23a) symbol description 1v in unregulated supply input. 2 gnd ground terminal. 3 shdn shutdown control input. the regulator is fully enabled when a logic high is applied to this input. the regulator enters shutdown when a logic low is applied to this input. during shutdown, output voltage falls to zero and supply current is reduced to 0.5 ? a (max). 4 nc no connect. 5v out regulated voltage output.
tc1223/tc1224 ds21368c-page 4 ? 2002-2012 microchip technology inc. 3.0 detailed description the tc1223 and tc1224 are precision fixed output voltage regulators. unlike bipolar regulators, the tc1223 and tc1224?s supply current does not increase with load current. in addition, v out remains stable and within regulation over the entire 0ma to i out max operating load current range, (an important consideration in rtc and cmos ram battery back-up applications). figure 3-1 shows a typical application circuit. the regulator is enabled any time the shutdown input (shdn ) is at or above v ih , and shutdown (disabled) when shdn is at or below v il . shdn may be controlled by a cmos logic gate, or i/o port of a micro- controller. if the shdn input is not required, it should be connected directly to the input supply. while in shutdown, supply current decreases to 0.05 ? a (typical) and v out falls to zero volts. figure 3-1: typical application circuit 3.1 output capacitor a 1 ? f (min) capacitor from v out to ground is recommended. the output capacitor should have an effective series resistance greater than 0.1 ? and less than 5.0 ? , and a resonant frequency above 1mhz. a 1 ? f capacitor should be connected from v in to gnd if there is more than 10 inches of wire between the regulator and the ac filter capacitor, or if a battery is used as the power source. aluminum electrolytic or tantalum capacitor types can be used. (since many aluminum electrolytic capacitors freeze at approxi- mately -30c, solid tantalums are recommended for applications operating below -25c.) when operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. tc1223 tc1224 v out shdn gnd nc 1 f + v in v out shutdown control (to cmos logic or tie to v in if unused) 1 f + battery +
? 2002-2012 microchip technology inc. ds21368c-page 5 tc1223/tc1224 4.0 thermal considerations 4.1 thermal shutdown integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160c. the regulator remains off until the die temperature drops to approximately 150c. 4.2 power dissipation the amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. the following equation is used to calculate worst case actual power dissipation: equation 4-1: the maximum allowable power dissipation (equation 4-2) is a function of the maximum ambient temperature (t a max ), the maximum allowable die temperature (t j max ) and the thermal resistance from junction-to-air ( ? ja ). the 5-pin sot-23a package has a ? ja of approximately 220c/watt. equation 4-2: equation 4-1 can be used in conjunction with equation 4-2 to ensure regulator thermal operation is within limits. for example: given: v in max = 3.0v 10% v out min = 2.7v ? 2.5% i load max = 40ma t j max = 125c t a max = 55c find: 1. actual power dissipation 2. maximum allowable dissipation actual power dissipation: p d ? (v in max ? v out min )i load max = [(3.0 x 1.1) ? (2.7 x .975)]40 x 10 ?3 = 26.7mw maximum allowable power dissipation: in this example, the tc1223 dissipates a maximum of 26.7mw; below the allowable limit of 318mw. in a similar manner, equation 4-1 and equation 4-2 can be used to calculate maximum current and/or input voltage limits. 4.3 layout considerations the primary path of heat conduction out of the package is via the package leads. therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower ? ja and therefore increase the maximum allowable power dissipation limit. where: p d ? (v in max ? v out min )i load max p d v in max v out min i load max = worst case actual power dissipation = minimum regulator output voltage = maximum output (load) current = maximum voltage on v in p d max = (t j max ? t a max ) ? ja where all terms are previously defined. p d max = (t j max ? t a max ) ? ja = (125 ? 55) 220 = 318mw
tc1223/tc1224 ds21368c-page 6 ? 2002-2012 microchip technology inc. 5.0 typical characteristics (unless otherwise specified, all parts are measured at temperature = 25c) note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.000 0.002 0.004 0.006 0.008 0.010 0.012 0.014 0.016 0.018 0.020 -40 -20 0 20 50 70 125 dropout voltage (v) i load = 10ma c in = 1 f c out = 1 f temperature ( c) dropout voltage vs. temperature (v out = 3.3v) 0.000 0.020 0.040 0.060 0.080 0.100 0.120 0.140 0.160 0.180 0.200 -40 -20 0 20 50 70 125 dropout voltage (v) i load = 100ma c in = 1 f c out = 1 f temperature ( c) dropout voltage vs. temperature (v out = 3.3v) 0 10 20 30 40 50 60 70 80 90 gnd current ( a) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 i load = 100ma c in = 1 f c out = 1 f ground current vs. v in (v out = 3.3v) v in (v) 0.000 0.010 0.020 0.030 0.040 0.050 0.060 0.070 0.080 0.090 0.100 -40 -20 0 20 50 70 125 dropout voltage (v) i load = 50ma c in = 1 f c out = 1 f temperature ( c) dropout voltage vs. temperature (v out = 3.3v) 0 10 20 30 40 50 60 70 80 90 gnd current ( a) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 i load = 10ma c in = 1 f c out = 1 f ground current vs. v in (v out = 3.3v) v in (v) 0 0.5 1 1.5 2 2.5 3 3.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 i load = 0 c in = 1 f c out = 1 f v in (v) v out (v) v out vs. v in (v out = 3.3v)
? 2002-2012 microchip technology inc. ds21368c-page 7 tc1223/tc1224 5.0 typical characteristics (continued) (unless otherwise specified, all parts are measured at temperature = 25c) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 i load = 100ma c in = 1 f c out = 1 f 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 v in (v) v out (v) v out vs. v in (v out = 3.3v) 4.985 4.990 4.995 5.000 5.005 5.010 5.015 5.020 5.025 -40 -20 -10 0 20 40 85 125 i load = 10ma v in = 6v c in = 1 f c out = 1 f temperature ( c) output voltage vs. temperature (v out = 5v) v out (v) 3.275 3.280 3.285 3.290 3.295 3.300 3.305 3.310 3.315 3.320 -40 -20 -10 0 20 40 85 125 i load = 10ma c in = 1 f c out = 1 f v in = 4.3v temperature ( c) v out (v) output voltage vs. temperature (v out = 3.3v) 0 10 20 30 40 50 60 70 -40 -20 -10 0 20 40 85 125 gnd current ( a) i load = 10ma v in = 6v c in = 1 f c out = 1 f temperature ( c) temperature vs. quiescent current (v out = 5v) 10.0 1.0 0.1 0.0 0.01k 0.1k 1k 10k 100k 1000k frequency (hz) output noise vs. frequency noise ( v/ hz) r load = 50 c out = 1 f c in = 1 f 1000 100 10 1 0.1 0.01 0 10 20 30 40 50 60 70 80 90 100 load current (ma) stability region vs. load current c out esr ( ) c out = 1 f to 10 f stable region s table re g io n -30 -35 -40 -45 -50 -60 -55 -65 -70 -75 -80 0.01k 0.1k 1k 10k 100k 1000 k frequency (hz) power supply rejection ratio psrr (db) i out = 10ma v in dc = 4v v in ac = 100mv p-p v out = 3v c in = 0 c out = 1 f
tc1223/tc1224 ds21368c-page 8 ? 2002-2012 microchip technology inc. 5.0 typical characteristics (continued) v out v shdn measure rise time of 3.3v ldo conditions: c in = 1 f, c out = 1 f, i load = 100ma, v in = 4.3v, temp = 25 c, fall time = 184 s v shdn measure rise time of 5.0v ldo conditions: c in = 1 f, c out = 1 f, i load = 100ma, v in = 6v, temp = 25 c, fall time = 192 s v out thermal shutdown response of 5.0v ldo conditions: v in = 6v, c in = 0 f, c out = 1 f i load was increased until temperature of die reached about 160 c, at which time integrated thermal protection circuitry shuts the regulator off when die temperature exceeds approximately 160 c. the regulator remains off until die temperature drops to approximately 150 c. v out measure fall time of 3.3v ldo conditions: c in = 1 f, c out = 1 f, i load = 100ma, v in = 4.3v, temp = 25 c, fall time = 52 s v out v shdn measure fall time of 5.0v ldo conditions: c in = 1 f, c out = 1 f, i load = 100ma, v in = 6v, temp = 25 c, fall time = 88 s v out v shdn
? 2002-2012 microchip technology inc. ds21368c-page 9 tc1223/tc1224 6.0 packaging information 6.1 package marking information ?1? & ?2? = part number code + temperature range and voltage ?3? represents year and quarter code ?4? represents lot id number 6.2 taping form (v) tc1223 code tc1224 code 2.5 l1 m1 2.7 l2 m2 2.8 lz mz 2.85 l8 m8 3.0 l3 m3 3.3 l5 m5 3.6 l9 m9 4.0 l0 m0 5.0 l7 m7 component taping orientation for 5-pin sot-23a (eiaj sc-74a) devices package carrier width (w) pitch (p) part per full reel reel size 5-pin sot-23a 8 mm 4 mm 3000 7 in carrier tape, number of components per reel and reel size user direction of feed device marking pin 1 standard reel component orientation tr suffix device (mark right side up) w p
tc1223/tc1224 ds21368c-page 10 ? 2002-2012 microchip technology inc. 6.3 package dimensions .071 (1.80) .059 (1.50) .122 (3.10) .098 (2.50) .075 (1.90) ref. .020 (0.50) .012 (0.30) pin 1 .037 (0.95) ref. .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) .024 (0.60) .004 (0.10) 10 max. .010 (0.25) .004 (0.09) sot-23a-5 dimensions: inches (mm) note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 2002-2012 microchip technology inc. ds21368c-page 11 tc1223/tc1224 7.0 revision history revision c (november 2012) added a note to each package outline drawing.
tc1223/tc1224 ds21368c-page 12 ? 2002-2012 microchip technology inc. notes:
? 2002-2012 microchip technology inc. ds21368c-page11 tc1223/tc1224 sales and support data sheets products supported by a preliminary data sheet may have an e rrata sheet describing minor operational differences and recom- mended workarounds. to determine if an erra ta sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
tc1223/tc1224 ds21368c-page12 ? 2002-2012 microchip technology inc. notes:
? 2002-2012 microchip technology inc. ds21368c-page 13 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2002-2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620767382 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
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